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May 1998

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Subject:
From:
"Graszl, Gerry (FL51)" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 4 May 1998 07:28:58 -0400
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 What solder fill requirement do you apply to solder cup/pins that do
not have a weep hole as noted in para 6.3.4 of J-STD-001B ?
Thank You.
Gerry Graszl
Material Quality Assurance
Honeywell Sensor & Guidance Products Division/GNO 813-539-4182

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