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May 1998

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Subject:
From:
Milind Rao <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 14 May 1998 06:10:20 PDT
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text/plain
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text/plain (27 lines) 
Hi
We are getting particles in both component holes / via holes on and off
and in double sided / multilayer boards. This is observed after pattern
plating
We use High build copper and Pattern plating.
In some holes the particles are severe and reduce the hole size
considerably. The problem is occuring very randomly.
Has anybody got remedy for this ?
Thanks in advance for the help
Milind


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