Dear TechNetters

I have a question about PCBs using leaded components versus PCBs using SMD
components.

Can anyone direct me to information that answers the following questions ?

(My application involves development of products for a commercial
environment.  However, it is a requirement that we achieve long MTBFs over
the standard commercial temperature range).

1. What are the criteria that should be used when deciding at the beginning
of a product development cycle whether to use SMD components or leaded
components on PCBs ?

2. I know, for example, one such criterion is mechanical stress and
acceleration of the completed board and assembly.  Above what value of g's
is SMD-based PWAs yield unacceptable short- and long-term reliability ?
(This is why, I believe, that the aviation industry continues to use leaded
component assembly methods).

3. Any other important criteria that must be considered.

Thanks in advance

Michael Yarrow
Techniplan International Pty Ltd
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