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May 1998

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Subject:
From:
Darrel Therriault <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 13 May 1998 15:21:31 -0700
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Technet,

My Mechanical Engineers just brought something to my attention that I would
like to get some opinions/advise/info from the TechNet expertise.

We have recently switched from HASL to OSP (Entek 106 I believe) finish for
our boards.  We run a ground plane around the perimeter of boards and
backplanes to help with EMI shielding and grounding in general.

Their concern is with the change to OSP finish, we are seeing bare copper
now that is tarnishing/oxidizing and is this still an acceptable grounding
contact where it bolts to the chassis or contacts a cardcage?

Other Questions :

1.   When the board is processed (IR) does the OSP get removed or does it
remain, and
     is it conductive or an insulator?

2.   What are the options for having the ground perimeter copper finished
so it won't
     oxidize and will provide a conductive surface for acceptable
ground/EMI contact?

I would appreciate any comments/opinions/advise.

Thanks..........DT

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