Are these Solid Solder Deposit systems compatible with double sided
reflow processes? I would imagine that the second side would form a
meniscus and all the flux would be used up during the first reflow
operation. Is there a manageable way around this?
Robert Furrow
>----------
>From: Steve Collins[SMTP:[log in to unmask]]
>Reply To: "TechNet E-Mail Forum." <[log in to unmask]>,Steve Collins
>Sent: Wednesday, May 13, 1998 11:45 AM
>To: [log in to unmask]
>Subject: Re: [TN] HASL alternatives
>
>Check out Mask Technology, Inc. They were at the recent IPC Expo. they have
>a video that is available their number is 714-557-3383 or 407 857-1876.
>Their process is called PPT Precision Pad Technology. . Their email is
>[log in to unmask]
>
>Steve Collins
>
>----------
>> From: Lolmaugh, Scott (AZ15) <[log in to unmask]>
>> To: [log in to unmask]
>> Subject: Re: [TN] HASL alternatives
>> Date: Wednesday, May 13, 1998 8:15 AM
>>
>> All,
>> There was an interesting article in the February issue of SMT Magazine
>> (IHS Publishing Group) on page 56, entitled: "End Paste Defects with
>> Solid Solder Deposits". This is a technique where the PWB Manufacturer
>> applies solder to the board, then runs the boards through polished
>> rollers to flatten the solder coating into a flat surface roughly the
>> same height as the soldermask. Then a tacky flux is applied and finally
>> an easy peel cover sheet. They claim the boards retain solderability
>> well and the paste stencil process is eliminated.
>>
>> There have been similar / identical techniques touted in the past, known
>> as:
>> "Sipad" (R) Siemens AG, (solderpaste application method)
>> "Optipad" (R) Viele Circuits Inc. and Burkle USA, (liquid solder
>> application method) and
>> "Precision Pad Technology or PPT (R) Mask Technology Inc. (solderpaste
>> application w/ textured finish)
>>
>> If anyone knows of domestic (USA) Manufacturers offering this technology,
>> I'd like to hear who they are.
>> Thanks
>> Best Regards,
>> Scott Lolmaugh
>> SMT Production Engineering
>> Honeywell IAC, Inc.
>> 602.313.3551 /FAX: 3402 (Please call first)
>>
>>
>> -----Original Message-----
>> From: [log in to unmask]
>> Sent: Wednesday, May 13, 1998 8:39 AM
>> To: [log in to unmask]
>> Subject: [TN] HASL alternatives
>>
>> To All,
>> We are now making a comparison between different alternatives to HASL.
>> The
>> chosen alternative will have to meet the following criterias criterias.
>>
>> - flat coating
>> - compatible with No-clean process and mixed technology
>> - resistant to 2-3 reflow (multiple heat cycle)
>> -and MINIMUM 1 year shelf life (storage before assembly)
>>
>> These are the alternatives we think can meet our needs:
>>
>> * OSP
>> - Benzimidazole (?)
>>
>> * IMMERSION
>> - Silver
>> - Bismuth
>> - Au-Ni
>> - Palladium
>>
>>
>> Q: Wich one do you think could be the best meet to our criterias ?
>>
>> Q: And what would be its advantage(s) compared to the others ?
>>
>> Q: OTHERS ? (is anyone using other coating alternative )
>>
>>
>> Thanks for all for your help
>>
>>
>> Nicolas van der Heyden
>>
>> ################################################################
>> TechNet E-Mail Forum provided as a free service by IPC using LISTSERV
>> 1.8c
>> ################################################################
>> To subscribe/unsubscribe, send a message to [log in to unmask] with
>> following
>> text in the body:
>> To subscribe: SUBSCRIBE TechNet <your full name>
>> To unsubscribe: SIGNOFF TechNet
>> ################################################################
>> Please visit IPC web site (http://jefry.ipc.org/forum.htm) for additional
>> information.
>> For the technical support contact Dmitriy Sklyar at [log in to unmask] or
>> 847-509-9700 ext.311
>> ################################################################
>>
>> ################################################################
>> TechNet E-Mail Forum provided as a free service by IPC using LISTSERV
>1.8c
>> ################################################################
>> To subscribe/unsubscribe, send a message to [log in to unmask] with
>following text in the body:
>> To subscribe: SUBSCRIBE TechNet <your full name>
>> To unsubscribe: SIGNOFF TechNet
>> ################################################################
>> Please visit IPC web site (http://jefry.ipc.org/forum.htm) for additional
>information.
>> For the technical support contact Dmitriy Sklyar at [log in to unmask] or
>847-509-9700 ext.311
>> ################################################################
>
>################################################################
>TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
>################################################################
>To subscribe/unsubscribe, send a message to [log in to unmask] with following
>text in the body:
>To subscribe: SUBSCRIBE TechNet <your full name>
>To unsubscribe: SIGNOFF TechNet
>################################################################
>Please visit IPC web site (http://jefry.ipc.org/forum.htm) for additional
>information.
>For the technical support contact Dmitriy Sklyar at [log in to unmask] or
>847-509-9700 ext.311
>################################################################
>
>
>
################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe: SUBSCRIBE TechNet <your full name>
To unsubscribe: SIGNOFF TechNet
################################################################
Please visit IPC web site (http://jefry.ipc.org/forum.htm) for additional information.
For the technical support contact Dmitriy Sklyar at [log in to unmask] or 847-509-9700 ext.311
################################################################
|
