Check out Mask Technology, Inc. They were at the recent IPC Expo. they have
a video that is available their number is 714-557-3383 or 407 857-1876.
Their process is called PPT Precision Pad Technology. . Their email is
[log in to unmask]

Steve Collins

----------
> From: Lolmaugh, Scott (AZ15) <[log in to unmask]>
> To: [log in to unmask]
> Subject: Re: [TN] HASL alternatives
> Date: Wednesday, May 13, 1998 8:15 AM
>
> All,
> There was an interesting article in the February issue of SMT Magazine
> (IHS Publishing Group) on page 56, entitled: "End Paste Defects with
> Solid Solder Deposits".  This is a technique where the PWB Manufacturer
> applies solder to the board, then runs the boards through polished
> rollers to flatten the solder coating into a flat surface roughly the
> same height as the soldermask.  Then a tacky flux is applied and finally
> an easy peel cover sheet.  They claim the boards retain solderability
> well and the paste stencil process is eliminated.
>
> There have been similar / identical techniques touted in the past, known
> as:
> "Sipad" (R) Siemens AG, (solderpaste application method)
> "Optipad" (R) Viele Circuits Inc. and Burkle USA, (liquid solder
> application method) and
> "Precision Pad Technology or PPT (R) Mask Technology Inc. (solderpaste
> application w/ textured finish)
>
> If anyone knows of domestic (USA) Manufacturers offering this technology,
> I'd like to hear who they are.
> Thanks
> Best Regards,
> Scott Lolmaugh
> SMT Production Engineering
> Honeywell IAC, Inc.
> 602.313.3551 /FAX: 3402 (Please call first)
>
>
>  -----Original Message-----
> From: [log in to unmask]
> Sent: Wednesday, May 13, 1998 8:39 AM
> To: [log in to unmask]
> Subject: [TN] HASL alternatives
>
> To All,
> We are now making a comparison between different alternatives to HASL.
> The
> chosen alternative will have to meet the following criterias criterias.
>
>  - flat coating
>  - compatible with No-clean process and mixed technology
>  - resistant to 2-3 reflow (multiple heat cycle)
>  -and MINIMUM 1 year shelf life (storage before assembly)
>
> These are the alternatives we think can meet our needs:
>
> * OSP
>         - Benzimidazole (?)
>
> * IMMERSION
>         - Silver
>         - Bismuth
>         - Au-Ni
>         - Palladium
>
>
> Q: Wich one do you think could be the best meet to our criterias ?
>
> Q: And what would be its advantage(s) compared to the others ?
>
> Q:  OTHERS  ? (is anyone using other coating alternative )
>
>
> Thanks for all for your help
>
>
> Nicolas van der Heyden
>
> ################################################################
> TechNet E-Mail Forum provided as a free service by IPC using LISTSERV
> 1.8c
> ################################################################
> To subscribe/unsubscribe, send a message to [log in to unmask] with
> following
>  text in the body:
> To subscribe:   SUBSCRIBE TechNet <your full name>
> To unsubscribe:   SIGNOFF TechNet
> ################################################################
> Please visit IPC web site (http://jefry.ipc.org/forum.htm) for additional
>  information.
> For the technical support contact Dmitriy Sklyar at [log in to unmask] or
>  847-509-9700 ext.311
> ################################################################
>
> ################################################################
> TechNet E-Mail Forum provided as a free service by IPC using LISTSERV
1.8c
> ################################################################
> To subscribe/unsubscribe, send a message to [log in to unmask] with
following text in the body:
> To subscribe:   SUBSCRIBE TechNet <your full name>
> To unsubscribe:   SIGNOFF TechNet
> ################################################################
> Please visit IPC web site (http://jefry.ipc.org/forum.htm) for additional
information.
> For the technical support contact Dmitriy Sklyar at [log in to unmask] or
847-509-9700 ext.311
> ################################################################

################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TechNet <your full name>
To unsubscribe:   SIGNOFF TechNet 
################################################################
Please visit IPC web site (http://jefry.ipc.org/forum.htm) for additional information.
For the technical support contact Dmitriy Sklyar at [log in to unmask] or 847-509-9700 ext.311
################################################################