Hi Technetee,
Anyone experience the solder ball appearing in the no-clean process?
What is the contributor? I forseen a misprinted PCB on the solder paste
station is one of it.
1. What is the recommendation on the smear board cleaning procedure?
2. Ultra-sonic cleaner?
3. What type of chemical?
4. If an ultra-sonic is the solution, then what is the side impact to
the package on double-sided process?
Hope anyone can share the info.
Thks.
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