TECHNET Archives

May 1998

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Nicolas van der Heyden <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 13 May 1998 09:27:50 -0400
Content-Type:
text/plain
Parts/Attachments:
text/plain (45 lines)
To All,
We are now making a comparison between different alternatives to HASL. The
chosen alternative will have to meet the following criterias criterias.

- flat coating
- compatible with No-clean process and mixed technology
- resistant to 2-3 reflow (multiple heat cycle)
-and MINIMUM 1 year shelf life (storage before assembly)

These are the alternatives we think can meet our needs:

* OSP
        - Benzimidazole (?)

* IMMERSION
        - Silver
        - Bismuth
        - Au-Ni
        - Palladium


Q: Wich one do you think could be the best meet to our criterias ?

Q: And what would be its advantage(s) compared to the others ?

Q:  OTHERS  ? (is anyone using other coating alternative )


Thanks for all for your help


Nicolas van der Heyden

################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TechNet <your full name>
To unsubscribe:   SIGNOFF TechNet 
################################################################
Please visit IPC web site (http://jefry.ipc.org/forum.htm) for additional information.
For the technical support contact Dmitriy Sklyar at [log in to unmask] or 847-509-9700 ext.311
################################################################


ATOM RSS1 RSS2