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May 1998

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Subject:
Re: bga standards
From:
Bev Christian <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 13 May 1998 08:17:52 -0400
Content-Type:
text/plain
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text/plain (54 lines) 
John,
Being work on by at least one IPC committee, one headed by Les Hymes.  In
Washington we were looking at % joint voiding, among other things. I didn't
make Tempe and was at other technical meetings in Long Beach so missed
Les's.  How far have we got, anyone out there?

regards,
Bev Christian
Nortel

> ----------
> From:         John Koleszar[SMTP:[log in to unmask]]
> Sent:         Tuesday, May 12, 1998 3:39 PM
> To:   [log in to unmask]
> Subject:      [TN] bga standards
>
> Does anyone know of an IPC standard for acceptability of
> bga joints?  These packages are not covered in 610, and I
> was curious if there was a seperate standard covering them
> or not.
>
> thanks,
>
> John Koleszar
> k-byte
> [log in to unmask]
>
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