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May 1998

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Subject:
From:
"Richard W. Boerdner" <[log in to unmask]>
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Date:
Tue, 12 May 1998 16:25:46 -0400
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howdy folks!

can anyone explain the possible causes in a manufacturing process that
would result in interplane separation when the boards are thermal
stressed??
the glass transition rating of the laminate material is 170-180 (FR4-06)
and the temperature cycle parameters are: -40 C to +50 C with a 6 degree
/min rate of rise, on hour dwell at the extremes, and 12 hour total
cycle time.

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