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Subject:
From:
Ken Patel <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 12 May 1998 10:35:46 -0700
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text/plain (106 lines)
Thanks Bruce. May be I should try myself.

re,
ken patel

At 12:58 PM 5/12/98 -0400, you wrote:
>     Ken,
>
>     If you have access to some small grinding tools, i.e. a variable speed
>     Dremel tool or better yet, cross-sectioning equipment, carefully grind
>     down three of the four sides of the perimeter of the lid. If you know
>     which end of the package the crystal is in, leave that edge alone;
>     grind the other three. Once you just start to break through, use a new
>     X-acto, with minimum penetration of the blade into the case, to pry
>     and slice open the unit. Fold back the lid along the unground edge,
>     and use it to hold the part. If you watch your grinding speed, and
>     don't use water, you won't introduce any foreign matter into the
>     package, or damage the crystal.
>
>     Once you're inside, you can examine the crystal under a normal 30X
>     microscope and check for cracks and chips in the crystal.  Sometimes,
>     the conductive epoxy used to cement them to the spring mounts, fills
>     the mounts - making them solid, which makes the part very vulnerable
>     to shock damage. Sometimes they're built just fine and as Tuan says
>     below, they're just too roughly handled. I've also seen solder shorts,
>     unsoldered pins, etc., which were manufacturing defects.
>
>     This delidding technique works well; I've done it many times.  Try it
>     out first on a few parts that you don't care much about before going
>     after one you want to seriously investigate.  Careful of the sharp
>     edges on the lid & package.
>
>     Bruce Tostevin
>     Benchmark Electronics
>     Hudson, NH
>
>
>______________________________ Reply Separator
_________________________________
>Subject: Re: [TN] Crystals/Oscillators failure
>Author:  Tuan300859 <[log in to unmask]> at 0UTG0ING
>Date:    5/11/98 6:30 PM
>
>
>Ken,
>
>I have experienced this failure before.  The root cause is definitely due to
>handling.  The crystal/oscillator is a  fragile component.  It can get damaged
>even in tube.  The crystal will crack  when drop  from a distance of 5 inches
>to a  hard surface.  My recommendation is to transport these crystal parts in
>a foam pads , not in tube and definitely not in bag.  And lastly,  all
>operators  from shipping, stockroom, hand load, and PC need to be awared of
>handling issue of the crystals/oscillators.
>
>I hope this helps!
>
>Tuan
>
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______________________________________________________
Ken Patel                       Phone:  (408) 490-6804
1708 McCarthy Blvd.             Fax:    (408) 490-6859
Milpitas, CA 95035              Beeper: (888) 769-1808

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