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May 1998

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Subject:
From:
Aric parr <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 12 May 1998 07:19:29 EDT
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text/plain (58 lines)
The actual requirements vary with paste, aperture, pad, component, reflow
profile......

Try this experiment:
        Modify screen printer (or use oversize stencils) so that you get 20%
and evaluate the yield
        Repeat this at 40% and evaluate the yield.

        Do a life cycle test on the solder joints and see if anything changes.

The data should indicate whether these parameters are accepable.
-------------
Original Text
From: C=US/A=INTERNET/DDA=ID/geezer(a)tc.fluke.com, on 5/11/98 3:39 PM:
TechNet,

I am currently inspecting solder paste deposits using a 3D inspection
system.  I
am in the process of setting control limits for the boards, but I have had
conflicting inputs.

I have recently heard that deposits should be 20% of target for warning
limits
and 40% of target for failure limits.  Should the target be the size of the
aperture or should it be less?  Is there an industry standard on paste
deposit
parameters?  Thanks for any input you can provide.

Sincerely,

Brian Geijsbeek

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