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May 1998

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Subject:
Paste Deposit Parameters
From:
Brian Geijsbeek <[log in to unmask]>
Reply To:
[log in to unmask]
Date:
Mon, 11 May 1998 12:26:13 -0700
Content-Type:
TEXT/PLAIN
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TEXT/PLAIN (27 lines) 
TechNet,

I am currently inspecting solder paste deposits using a 3D inspection system.  I
am in the process of setting control limits for the boards, but I have had
conflicting inputs.

I have recently heard that deposits should be 20% of target for warning limits
and 40% of target for failure limits.  Should the target be the size of the
aperture or should it be less?  Is there an industry standard on paste deposit
parameters?  Thanks for any input you can provide.

Sincerely,

Brian Geijsbeek

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