Phil Crepeau:
- If this is up for a vote, I vote with Werner and those folks who feel that
"the bigger the blob the better the job" does not apply to SMT.
- My vote is based on the results of an Air Force Manufacturing Technology
Study some years ago.  If I recall correctly, that showed that larger
connections lasted longer only because the rate of crack propagation through
solder is fairly consistent, therefore it takes a larger volume of solder
longer to "fail" because it takes the crack more time to severe the
connection.  The study found a solder connection with smaller solder volume
tended to last longer before cracks occurred and therefore were/are considered
more reliable.  I have taken a quick look and cannot find a direct reference
to the study in my files.  You might check with the MANTECH Information Office
at Wright Labs., Wright Patterson AFB where I think most of the AF MANTECH
tests are archived.
- Just my .02 worth.  Jim Moffitt

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