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May 1998

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Subject:
From:
"Edward J. Valentine" <[log in to unmask]>
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Date:
Fri, 8 May 1998 13:30:19 -0700
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Vaughan, Ralph H wrote:
>
> Greeting,
>
> We are seeing a rash of glass surface mount diodes cracking somewhere
> during assembly.  It isn't noticed until upper-level module assembly,
> but the #1 suspect is card assembly.  All that have broken have been
> bonded to the board with an industry standard chipbonder, and some are
> mounted to the solder side of a wave-soldered polyimide board.  The part
> size is .140w x .230L x .140h.  We have run thermal cycles and wave and
> convection soldering on test samples, but can't reproduce the problem,
> so we suspect rough handling at the module levels.
> Anyone ever run into this?
>
> Ralph
>
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Ralph -

Handling is a good assumption.  Try especially where the board assembly
is flexed, like in a bed-of-nails tester.  Ed Valentine
--

ProTronics, Inc.
861 Old Knight Road
Knightdale, NC 27545
Phone: (919) 217-0007, Fax: (919) 217-0050
http://www.protronics-inc.com

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