Jason,
In normal soldering operations even with somewhat longer times with liquid
solder, the intermetalic compound layers do not grow to a level one needs to
be concerned about. This myth has somehow spread through the industry and has
produced large amounts of inadequately wetted solder joints—a really bad
defect. And yes, intermetallic compounds are brittle, but with the exception
of the gold and solver IMCs with tin, they are brittle but strong (much
stronger than solder).

Werner Engelmaier
Engelmaier Associates, L.C.
Electronic Packaging, Interconnection and Reliability Consulting
7 Jasmine Run
Ormond Beach, FL  32174  USA
Phone: 904-437-8747, Fax: 904-437-8737
E-mail: [log in to unmask]


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