Hi Phil
I think you misled the populus with that doubled ITM on web address .
You smoke too much .
Neat site indeed .
What T/H reflow 's got to do with glue dilemma ? Plan stuffing caps to
holes ?
While you are at it ; the holes fill much better with dispenser ; hope
you mentioned it in your papers ;
than to pay for bilevel stencils or other solutions supporting SSteel
scrap yards ( old stencils make a classy corporate lamp shades [gold
plated] - or slug it on R&D Tshirts) ;
 but that's beside the subject on hand .
You right ; can't please them all .

See you                 paul

>----------
>From:  TheITMTeam[SMTP:[log in to unmask]]
>Sent:  Friday, 8 May 1998 10:08
>To:    Paul Klasek; [log in to unmask]
>Subject:       Re: [TN] ASSEMBLY
>
>Russ -
>I strongly agree with Paul and Steve.  Hey, if you don't have to glue, then
>don't.
>Stencil printing of glue or multi-heads are nice -but I happen to be a big
>advocate of Reflow of Through-hole (also known as Intrusive Soldering, Paste
>in Pin, Pin in Paste, etc.etc.).  Not only do I advocate it, but I practice
>what I preach.  I also have a paper on this (that I co-authored with Joe
>Belmonte in the Sept. '96 edition of Circuits Assy) on my website.  In
>addition, you can also check out papers and work done by Bill Barthell
>(Plexus), Bob Willis and you'll also find a paper by Martha Rupert of AMP on
>AMP's website.  It is also a popular topic here on the Technet.
>It's not for every application, but Paul put it well, it should be the first
>priority you should be looking at.  And so should anyone else who is gluing
>parts and wavesoldering.
>Of course now I'll catch the ire of the wavesolder manufacturers but, hey -
>long live reflow!
>
>Phil Zarrow
>ITM, Inc.
>Durham, NH
>www.ITM-ITM-SMT.com
>

################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TechNet <your full name>
To unsubscribe:   SIGNOFF TechNet 
################################################################
Please visit IPC web site (http://jefry.ipc.org/forum.htm) for additional information.
For the technical support contact Dmitriy Sklyar at [log in to unmask] or 847-509-9700 ext.311
################################################################