Russ -
I strongly agree with Paul and Steve.  Hey, if you don't have to glue, then
don't.
Stencil printing of glue or multi-heads are nice -but I happen to be a big
advocate of Reflow of Through-hole (also known as Intrusive Soldering, Paste
in Pin, Pin in Paste, etc.etc.).  Not only do I advocate it, but I practice
what I preach.  I also have a paper on this (that I co-authored with Joe
Belmonte in the Sept. '96 edition of Circuits Assy) on my website.  In
addition, you can also check out papers and work done by Bill Barthell
(Plexus), Bob Willis and you'll also find a paper by Martha Rupert of AMP on
AMP's website.  It is also a popular topic here on the Technet.
It's not for every application, but Paul put it well, it should be the first
priority you should be looking at.  And so should anyone else who is gluing
parts and wavesoldering.
Of course now I'll catch the ire of the wavesolder manufacturers but, hey -
long live reflow!

Phil Zarrow
ITM, Inc.
Durham, NH
www.ITM-ITM-SMT.com

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