Hey Russ -
I always seem to annoy the auto-dispense folks when I bring it up, but stencil
printing of adhesives is a great process and has been used for years.  Of
course you have to have a flat, planar board, with no protruding leads or
such.  And clean up of adhesive off the stencil can be a bit more involved
than cleaning solder paste off.  But you can get some real through-put with
this process.
I wrote about it in my "On The Forefront" column (Circuits Assembly Magazine)
a while back and it is on the ITM homepage under "articles" if you want to
read it.
Also, MPM has done a lot of work in this area including DOE to determine good
printing parameters.  A number of the adhesive companies, such as Heraeus,
have also characterized the print parameters for their formulations.  Check
with them as well.
Good luck and, as you usually do, have fun.
Regards,

Phil Zarrow
ITM, Inc.
Durham, NH
www.ITM-SMT.com

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