Greeting,

We are seeing a rash of glass surface mount diodes cracking somewhere
during assembly.  It isn't noticed until upper-level module assembly,
but the #1 suspect is card assembly.  All that have broken have been
bonded to the board with an industry standard chipbonder, and some are
mounted to the solder side of a wave-soldered polyimide board.  The part
size is .140w x .230L x .140h.  We have run thermal cycles and wave and
convection soldering on test samples, but can't reproduce the problem,
so we suspect rough handling at the module levels.
Anyone ever run into this?

Ralph

################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TechNet <your full name>
To unsubscribe:   SIGNOFF TechNet 
################################################################
Please visit IPC web site (http://jefry.ipc.org/forum.htm) for additional information.
For the technical support contact Dmitriy Sklyar at [log in to unmask] or 847-509-9700 ext.311
################################################################