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May 1998

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Subject:
Re: Solder Fracture Problems
From:
Janice M LePage <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 7 May 1998 09:53:35 -0700
Content-Type:
text/plain
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text/plain (23 lines) 
Steve,
  The boards we use are not as complex as yours but, we did have problems
with warping and fractured solder connections on DIP's and gold plated
components.  We did a good pre-tinning on the leads and found this to help
the problem.  If the tinning is not good through we ended up with fractured
solder connections.

Hope this will help some.

JL

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