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| Reply To: | TechNet E-Mail Forum. |
| Date: | Wed, 6 May 1998 18:49:32 -0700 |
| Content-Type: | text/plain |
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Fred Johnson wrote:
>
> Call Shipley, they used to have one. As I recall, there is a lot of difficulty
> in controlling the tin/lead ratio with an electroless solution, but you can
> certainly give it a try.
> In Mpls, call Ken Kamm at 612/476-2794
>
> >>> <[log in to unmask]> 05/06/98 02:31pm >>>
> From: Dennis J Fall@TFT on 05/06/98 02:31 PM
>
> To: [log in to unmask]
> cc:
> Subject: Electroless Solder Plating Solution
>
> Can anyone give me some info on an electroless solder plating/tinning
> solution. I know that something has to exist.
>
> Thanks
>
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> ################################################################I believe Ueyemura also markets and services an electroless tin-lead.
This company has its US office in Ontario, Cal. A few years ago, I saw
the process working at two pwb facilities in Japan. It did require very
close vigilance, but the reflowed deposit was bright, and both facilities
were using the process on fine pitch surface mount applications. I
beleive around 10 mil pitch.
hope this helps.
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Please visit IPC web site (http://jefry.ipc.org/forum.htm) for additional information.
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