TECHNET Archives

May 1998

TechNet@IPC.ORG
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Sender:
TechNet <[log in to unmask]>
Date:
Tue, 5 May 1998 13:35:10 +0000
Reply-To:
"TechNet E-Mail Forum." <[log in to unmask]>, Steves <[log in to unmask]>
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Subject:
Re: New alternative surface finishes
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1.0
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From:
Steves <[log in to unmask]>
Comments:
Authenticated sender is <steves@[192.9.200.45]>
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text/plain (16 lines) 
Last year IPC held the 1st Summit on PWB surface finishes and
solderability.  It may contain a lot of the information you are
looking for.  Contact IPC to buy a copy.

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