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May 1998

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TechNet <[log in to unmask]>
Subject:
1206 jumper
From:
[log in to unmask]
Date:
Thu, 28 May 1998 07:27:50 -0500
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"TechNet E-Mail Forum." <[log in to unmask]>, [log in to unmask]
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text/plain (22 lines) 
I have a component that is glue cured on the bottom of a pcb.  The
component is a 1206 size jumper.  It is made up of iron/nickel alloy.  The
problem I am having is that the part will fall off the board during wave
solder.  Is the component not able to withstand all the heat of the solder
pot being that it is a solid metal material?  Any ideas or solutions would
be appreciated.

Rob Williams
[log in to unmask]

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