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May 1998

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Sender:
TechNet <[log in to unmask]>
Subject:
Re: Solderability Test for BGA
From:
Jim Marsico 516-595-5879 <[log in to unmask]>
Date:
Tue, 19 May 1998 15:48:00 -0400
MIME-version:
1.0
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MULTIPART/MIXED; BOUNDARY="Boundary_[ID_HEo4Ioq4xCJwG49kHmAhCw]"
Reply-To:
"TechNet E-Mail Forum." <[log in to unmask]>, Jim Marsico 516-595-5879 <[log in to unmask]>
Parts/Attachments:
TEXT/PLAIN (121 bytes) , MESSAGE/RFC822 (3476 bytes) , MESSAGE/RFC822 (1185 bytes) 
I asked this same question to Technet back in November of 1996 and received
only one response.  I attached it for reference.

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