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Reply To: | TechNet E-Mail Forum. |
Date: | Fri, 8 May 1998 09:24:46 +1000 |
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Russ
If you can put on a multihead ; ask Asymtek for dual or multineedles if
your pattern is regularly doubled or multi .
Dual head with single and multineedle could buy you some time .
Check Camelot's web side ; their latest multihead claims 120K/h , 100
more likely , but still , in volumes on shifts on 1K+ bom you have this
alternative .
Phil may have mastered the difficult task of glue print ; but I hear
more Steve's "do you really need glue at all ?" ;
from one more point :
Down here apart from ours is few reflows with a chiller giving up to
25'C difference between top and bottom on the solder zone ;
good enough to hold PLCC's upside down without a drop for a year (
tested with one sub here on contract with a wild design) .
The likelihood of your reflow (conv) to cope with retrofit is high .
It works .
So, to sum it up in descending order :
1
Dual side soldering refow ; when we ended validations Ersa came ahead of
the Electrovert and Heller .
Literally blows your glue woes to archives .
2
See if you can tinker up your trusty Asymtek ;
3
Than is the print ; with all due respect to what is achieved in this
field and not being annoyed by Phil ;
it's still easier to think hard than to work hard .
Good luck paul ; ResMed
>----------
>From: Vertefeuille, Russ (AZ77)[SMTP:[log in to unmask]]
>Sent: Friday, 8 May 1998 5:11
>To: [log in to unmask]
>Subject: [TN] ASSEMBLY
>
>Hello all,
>
>could anyone with experience (good or bad) with printing of smt adhesive
>prior to placement and wave solder respond .
>
> We are presently applying glue dots using an old Asymtek 403. It does a
>good job, but component counts are increasing to over 1K parts per board
>leaving the pick and place machine idle waiting for the glue dot process to
>finish.
>
>Any pros and cons or pitfalls would be appreciated.
>
>Thanks,
>
>Russ Vertefeuille
>Sr. Project Engineer
>Honeywell, BCAS
>Glendale, AZ.
>
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