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May 1998

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Subject:
Soldermask over Vias for BGA pin escapes
From:
Pat Paulson <[log in to unmask]>
Reply To:
DesignerCouncil E-Mail Forum.
Date:
Wed, 20 May 1998 12:44:23 -0500
Content-Type:
text/plain
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text/plain (24 lines) 
Our assembly house wants the vias under the BGA to be covered with solder
mask therefore the bottom should be covered too.  This means these are not
valid test points.

What are other people doing to get around this problem.

The pads for the 50 mil pitch bga part are 25 mils and the escape via is 28
mils.

Thanks again!
Pat

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