Hello Bernard,
I was curious to see how you are doing with the procedure. I am going to
start one now also.
Your Email has made me think that it is a good idea for my job too. I am
not a process engineer I am a PCB designer. My idea is to take the
gerber file that I create from my layout cad software and create a print
for Incoming Quality inspectors to verify the stencil correct. But now I
feel I need to understand and create a procedure so that the stencils
are created consistently from board to board. Please email any
suggestions or generic forms that I may use and as I develop mine I will
copy you for any feedback. Maybe together we can get a good document.

Jim Walton
[log in to unmask]
Automotive Group

> -----Original Message-----
> From: Bernard P. Domingo [SMTP:[log in to unmask]]
> Sent: Monday, April 13, 1998 8:59 PM
> To:   [log in to unmask]
> Subject:      [DC] Stencil Procedural Design
>
> Dear Sir/Madam:
> Greetings!  My name is Bernard P. Domingo, SMT Process Engineer from
> EAI in the Philippines.  I've received your catalog and Iwant to thank
> you for all that information.  In line with this, I'm going to make a
> Project about Stencil Procedural Design, which will be our Company
> Standard regarding Stencil Design.  This will touch matters regarding
> correct aspect ratio, snap-off distance, and pad-to-apperture
> measurements.  this project has the objective of eliminating or
> minimizing defects such as solder balls and splashes.  Your help will
> be very much appreciated.  If you could send me some information
> regarding Stencil Procedural Design.
>
> Hoping for your cooperation.  Thank you very much and More Power!
>
> Bernard P. Domingo
> E-mail:  [log in to unmask]
>
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