LISTSERV - DESIGNERCOUNCIL Archives

DESIGNERCOUNCIL Archives

May 1998

DesignerCouncil@IPC.ORG

	LISTSERV Archives
	DESIGNERCOUNCIL Home
	DESIGNERCOUNCIL May 1998

	Log In
	Register

	Subscribe or Unsubscribe

	Search Archives

Options:	Use Monospaced Font Show Text Part by Default Show All Mail Headers
Message:	[<< First] [< Prev] [Next >] [Last >>]
Topic:	[<< First] [< Prev] [Next >] [Last >>]
Author:	[<< First] [< Prev] [Next >] [Last >>]

Subject:	Re: Soldermask over Vias
From:	Doris Holden <[log in to unmask]>
Reply To:	DesignerCouncil E-Mail Forum.
Date:	Tue, 19 May 1998 18:49:51 -0500
Content-Type:	text/plain
Parts/Attachments:	text/plain (53 lines)

----------
> From: Scott Buscomb <[log in to unmask]>
> To: [log in to unmask]
> Subject: [DC] Soldermask over Vias
> Date: Friday, May 15, 1998 11:29 AM
>
> What are the drawbacks to tenting vias? I am planning on tenting vias
> using LPI both sides on SMOBC. The vias are .013 and .020. I realize the
> LPI is pulled into the holes causing a thinning of the mask.
> I am trying to prevent solder bridging during reflow and wave soldering.
>
> Any comments would be appreciated.
> TIA,
> Scott Buscomb
>

Engineering Services Network has tried tenting vias on one side  The board
vendors didn't like it because flux could get trapped during reflow.

The mask leaked to the bottom side and if that via was a test point it
didn't make contact with the test pin.

We have gone back to untented vias because of all the problems they caused

Pete Holden

> ################################################################
> DesignerCouncil E-Mail Forum provided as a free service by IPC using
LISTSERV 1.8c
> ################################################################
> To subscribe/unsubscribe, send a message to [log in to unmask] with
following text in the body:
> To subscribe:   SUBSCRIBE DesignerCouncil <your full name>
> To unsubscribe:   SIGNOFF DesignerCouncil
> ################################################################
> Please visit IPC web site (http://jefry.ipc.org/forum.htm) for additional
information.
> For technical support contact Hugo Scaramuzza at [log in to unmask] or
847-509-9700 ext.312
> ################################################################

################################################################
DesignerCouncil E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE DesignerCouncil <your full name>
To unsubscribe:   SIGNOFF DesignerCouncil 
################################################################
Please visit IPC web site (http://jefry.ipc.org/forum.htm) for additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312
################################################################

ATOM RSS1 RSS2

LISTSERV.IPC.ORG