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May 1998

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Subject:
From:
Shawn Utz <[log in to unmask]>
Reply To:
DesignerCouncil E-Mail Forum.
Date:
Tue, 19 May 1998 14:38:55 -0700
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Scott,
Entrapment of process chemicals could arise, especially if using OSP.
Blow out of entrapped air causing a volcano looking tent.

We have resorted to a 1:1 of the finished hole diameter to allow venting.
This has worked quite well.
Keep in mind LPI sticks to Cu much better than Au.

Have a nice day,

Shawn Utz
Tera Computer Co.

>
> From: Scott Buscomb <[log in to unmask]>
> Subject:      [DC] Soldermask over Vias
> To: [log in to unmask]
> Content-Type> : > text/plain> ; > charset=us-ascii>
> Content-Length: 1048
>
> What are the drawbacks to tenting vias? I am planning on tenting vias
> using LPI both sides on SMOBC. The vias are .013 and .020. I realize the
> LPI is pulled into the holes causing a thinning of the mask.
> I am trying to prevent solder bridging during reflow and wave soldering.
>
> Any comments would be appreciated.
> TIA,
> Scott Buscomb
>
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