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May 1998

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Subject:
Soldermask over Vias
From:
Scott Buscomb <[log in to unmask]>
Reply To:
DesignerCouncil E-Mail Forum.
Date:
Fri, 15 May 1998 12:29:03 -0400
Content-Type:
text/plain
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text/plain (21 lines) 
What are the drawbacks to tenting vias? I am planning on tenting vias
using LPI both sides on SMOBC. The vias are .013 and .020. I realize the
LPI is pulled into the holes causing a thinning of the mask.
I am trying to prevent solder bridging during reflow and wave soldering.

Any comments would be appreciated.
TIA,
Scott Buscomb

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