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May 1998

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Subject:
Minimum routing layers for a 256 pin BGA part with 1.27mm pitch
From:
Pat Paulson <[log in to unmask]>
Reply To:
DesignerCouncil E-Mail Forum.
Date:
Wed, 13 May 1998 12:38:55 -0500
Content-Type:
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I'm working on my first design using a BGA part and I'm looking for any
ideas that would be helpful.  I'm using a 25 mil pad for the solder ball
with pin escapes (through hole vias) for each pad. These pin escapes are
placed in the same direction so the solder side of the pcb looks like the
bga footprint for de-bug purposes.

I guess this means I have to use 4 layers to route away from the part? Are
there any tricks that I'm missing? I'm ready to say the heck with pin
escapes at the part.  What techniques do other people use?  I'm using 6/6
widths/spacing.

Thank you for your ideas/help!

Pat Paulson
VTEL Corp.
[log in to unmask]

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