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Reply To: | DesignerCouncil E-Mail Forum. |
Date: | Fri, 1 May 1998 14:47:01 -0500 |
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Greetings fellow designers...
I'm having a bit of trouble explaining the reasoning behind using hatch
fill vs. solid fill on outer layers. I have, in the dark recesses of my
brain, a memory of a rule of thumb saying to hatch any fill areas larger
than 1 sq. inch. I believe this was to prevent sucking too much heat
during the soldering process, sucking too much solder during wave
soldering (in uncoated use), and/or to prevent warping of the board.
We currently have a board approx. 6x5 inches, predominately fill
(chassis ground) on the secondary side. We are using soldermask over
bare copper on this 2-sided, .062, FR4 board.. The previous incarnation
of this board was somewhat smaller and used solid fill with no
problems. Now I find myself trying to defend my choice of using hatch
fill on the new board. Perhaps my "rule of thumb" is no longer valid or
was a myth originally. It is easy convince others about the sucking up
solder when uncoated issue, but since we have SMOBC they don't see this
as a problem. Are the warping and heat sinking issues valid? Are there
other issues/concerns I should address or use in my defense? On the
other hand, I don't mind if I'm wrong - solid/hatch is just a button
push away!!!
Thanks for any assistance you can provide.
Ben Davis
Systems & Electronics, Inc.
[log in to unmask]
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