Hello,
Can somebody please tell me the difference between Direct laser
Imaging (DLI) and Direct laser writing (DLW). I am aware that DLW is used on MCM
programmable substrates and I assume this operation is done using a
laser beam . Is DLI following on a similar principle except that the
features are simply imaged onto the substrate, and how is the
acheived if one of the advantages of LDI is that their is no
requirement for a mask.
Cheers
Gareth
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