> Now for the question. Why do we get unsoldered connections? Most are
> chip components where one end solders beautifully, the other end is
> sitting on a rounded mound of solder. The distribution across the
> substrate and from one substrate to the next appears to be random.
Look for masking material between pads acting as a fulcrum.Once masking
material is about 3 mils above the pad metal i've seen the onset of
drawbridges which is what you may have.
Regards,
John Maxwell
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