------- Forwarded Message Follows -------
From:          Self <COMMFS1/RICHARDR>
To:            KIM BEHR
Subject:       BGA
Date:          Wed, 6 May 1998 14:54:17

Hi Kim,

I am currently doing a pcb design layout that requires a 256 pin ball
grid array.

I have your IPC catalog (1996) which appears to be out of date.

The footprint dimensions of the BGA that I require has an additional
16 pins in the centre of the package.

Could you please email me the necessary data for this device.

Thank you,

Richard Rielly  (Hardware Design Engineer-UEC)

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