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May 1998

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From:
"Gerald G. Gagnon" <[log in to unmask]>
Date:
Tue, 5 May 1998 11:57:53 -0400
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"TechNet E-Mail Forum." <[log in to unmask]>, "Gerald G. Gagnon" <[log in to unmask]>
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Hello All

I am in need of density values for:

Electrolytic "hard" gold used for card edge fingers
Electrolytic "soft" gold used for wire bonding
Immersion gold used for solderable surface

The above would reflect the deposit metallurgy typically expected for
each end use.

Thanks and regards

Gerry

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