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May 1998

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TechNet <[log in to unmask]>
Subject:
Re: RLP532A (PQFP-132) Land Pattern
From:
Jorg Richstein <[log in to unmask]>
Date:
Fri, 29 May 1998 10:29:26 +0200
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Colin Weber <[log in to unmask]>
Reply-To:
"TechNet E-Mail Forum." <[log in to unmask]>, Jorg Richstein <[log in to unmask]>
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Colin

We have converted for these kind of geometries IC from HAL to flash gold
applications and generally speaking with good results. Do you have other FP
or FP similar geometries on this board? If so, and if they show no similar
problems you can probably exclude assembly process problems of your vendor
and home in on pcb design issues (like your mentioned heat sinking one).

J




örg

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