Mime-Version: |
1.0 |
Sender: |
|
Subject: |
|
From: |
|
Date: |
Tue, 19 May 1998 11:33:55 -0400 |
Content-Type: |
text/plain; charset="us-ascii" |
Reply-To: |
|
Parts/Attachments: |
|
|
Sorry for my earlier mail without subject
------------------------------------------------------------------------
To all,
We are in the process of buying an automatic stencil (+printed board)
cleaner.
We would like to know if it is compatible with these kind of protective
coating (a
replacement to the HASL with Tin-Lead) or needs some special precaution.
**- OSP (organic solderability preservatives),
**- Au-Ni ,
**- Silver (by immersion).
We will use the MEGASOLV JB cleaning solution.
All information will be very appreciated.
Thanking you
,,
( . . )
----------o00---O---00o----------------------------------
Nicolas van der Heyden
------------------------------------------------------------
################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe: SUBSCRIBE TechNet <your full name>
To unsubscribe: SIGNOFF TechNet
################################################################
Please visit IPC web site (http://jefry.ipc.org/forum.htm) for additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312
################################################################
|
|
|