TECHNET Archives

May 1998

TechNet@IPC.ORG
Options: Use Monospaced Font
Show Text Part by Default
Condense Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Content-Type:
multipart/alternative; boundary="------------0B55E1B687CB3D21778381E0"
Sender:
TechNet <[log in to unmask]>
Subject:
Re: PCB Solder Sample: Solderability Test
From:
John Waite <[log in to unmask]>
Date:
Mon, 11 May 1998 18:38:08 -0400
MIME-Version:
1.0
X-To:
Ken Patel <[log in to unmask]>
Reply-To:
"TechNet E-Mail Forum." <[log in to unmask]>, John Waite <[log in to unmask]>
Parts/Attachments:
text/plain (2980 bytes) , text/html (3523 bytes)

ATOM RSS1 RSS2