Yes, you are correct. The OSP is a temporary oxidation inhibitor.
You can paste the pads during smt process, this works quite well
and is a common practice.
It is done frequently on our designs and manufactring process.
If the boards is to be  wave soldered , that will cover the bottom side.
If the design is all thru hole , you may be better off with HASL or
you will need to get solder onto those pads needing to make good electrical
connection long term.

Tim Easterling
SCI Systems Inc.
(256) 882 4426

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