I just noticed a few more Emails on double sided reflow and pin in hole
reflow assembly. Some Technet Readers may be interested to know that a
report on each subject may be available shortly from the SMTA main office
in the USA (612) 920 7682. Both reports were produced by The SMART Group,
they are Charity Reports which we produce each year to raise money for a
named Charity. The PIHR report at the last count has raised over £1000 in
the UK with all the proceeds going to a Brighten based homeless charity.

It is proposed that all the money raised from the reports sold in the USA
would go towards a memorial fund being organised by the SMTA.

The report on (PIHR) Pin In Hole Reflow covers:

PCB Design and Component Requirements
PIHR Advantages and Disadvantages
Paste Application by Stencil Printing, Double Stencil Print, Dispensing

Stencil Aperture Calculations
Solder Pallet Support
Reflow Soldering Profiles
Inspection Requirements
Microsection Analysis
Process Defects

The (DSR) Double Sided Reflow Report covers:

PCB design rules
Through hole reflow
Component issues
Component placement
Board support
Solder paste requirements
Profiling double sided boards

Process issues
        Board flexture - Reflow conveyor vibration
        Component weight

Process Defects
        Lost components - Lifted leads - Component damage
        Solder joint movement - Solder voids


Bob Willis
Vice President SMART Group

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