Joe,

I will comment with assumptions.

Our product goes into plastic housing, front and back. We have resulted
in mounting a spring on both sides of the PWB to the respective plastic
on which we have mounted a metallic 'sheet'. This has greatly reduced
the effects of ESD/RFI/EMI on the equipment.

If this sounds like it may be close to what you are looking at, feel
free to contact me further for more details.

Richard Hamilton
Clemar Mfg. / Rain Bird
[log in to unmask]

> -----Original Message-----
> From: Joe Reichert [SMTP:[log in to unmask]]
> Sent: Wednesday, April 01, 1998 7:18 AM
> To:   [log in to unmask]
> Subject:      [TN] Grounding PCB to Case
>
> >We currently have a PCB that will be put in an extrusion with front
> and back
> >panels that will be screwed on.  Would anyone have any information on
> >grounding criteria or techniques for attaching all three parts of the
> case to
> >earth ground on the PCB?  I have looked at UL508, but it seems a
> little too
> >wide open.  Any help would be appreciated!!
> >
> >Thanks,
> >
> >Joe Reichert
> >Lake Shore Cryotronics, Inc.
> >[log in to unmask]
> >
>
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