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April 1998

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Subject:
From:
Lisa Williams <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 6 Apr 1998 14:27:02 -0500
Content-Type:
text/plain
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text/plain (38 lines)
From IPC-6012:


3.2.6.6 Gold Plating-- Electrodeposited gold plating shall be in accordance with
MIL-G-45204. Class and Type shall be specifed on the procurement documentation. For
Class 3 boards, gold plating shall be Type II or III Class 1.

Table 3-2, Final Finish, Surface Plating Coating Requirements
Gold (min) for edgeboard connectors and areas not to be soldered:  Class 1, 0.8 um;
Class 2, 0.8 um; Class 3, 1.3 um.
Gold (max) on areas to be soldered:  Class 1, 0.8 um; Class 2, 0.8 um; Class 3, 0.8
um.


Lisa Williams
IPC
2215 Sanders Road
Northbrook, IL  60062
URL:  www.ipc.org

>>> <[log in to unmask]> 04/06/98 01:01PM >>>
     Can anyone refer the document that states proper wording of a gold
     over nickel finish?

     Thanks

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