Hi Tim,
    A couple of observations from a board manf. perspective:

1) Be careful of the desiccant you use.  Some will give off a silicon oxide
vapor and may inhibit any subsequent soldering operations.
2) Try to discipline all involved with the handling of the moisture
sensitive components.  This may be the least expensive/extensive method.
Also follow common sense baking and storage practices.
3) There is a packaging technique we used for some accounts call "DryPak".
this involved the use of a desiccant, a 3M antioxidant strip, and a humidity
tag. We would then seal the board in a Static Shielding bag.  (Be careful
how you spec out the bag, some are just a oily coating over a pinkish bag).
This may be an overkill, but it improved a couple of solderability and
moisture absorption issues for our customers.  Be aware that unless you spec
out and supply the materials, there may be an additional cost.  If you Email
me, I can get you some more specifics.  I would also visit the IPC and
Milspec pages for other details.   Good luck.. JOHN WAITE
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