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April 1998

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Subject:
From:
Greg Bartlett <[log in to unmask]>
Reply To:
Greg Bartlett <[log in to unmask]>
Date:
Wed, 1 Apr 1998 10:30:28 +0000
Content-Type:
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text/plain (120 lines)
Dwight,
We've had similar frustrations trying to learn about the compatibility
between gold compliant pins and OSP coated boards.  It's true that this
combination has been used successfully by many large OEMs for years, but we
learned that the vast majority of cases were with the earlier
benzotriazole-based formulations (thinner, single-reflow OSPs).  I talked with several
people who believed that there should be no problem with such a
combination, but they were more apprehensive about the compatibility between the
thicker, multiple-reflow OSPs and gold compliant pins.

Best regards,
Greg Bartlett
Mercury Computer Systems
Chelmsford, MA
[log in to unmask]

>Actually the hotter topic of discussion and uncertainty is about using
gold
>pins in bare copper (OSP) or gold boards. Several large telecom
>manufacturers and mainframe manufacturers have been pressing into gold
and
>OSP coated boards for at least 10-15 years (even in outdoor telecom
app's)
>but also haven't made their data public as far I've been able to find in
>literature searchs et al.
>
> I'd love to see some data too. I'm planning to do the
experiment/generate
>the data on our own this year.  Crew at Litton/IPE and IBM Endicott are
the
>only contacts I've made who have done any of the basic science --
everyone
>else I've come across who's willing to discuss it just has anecdotes and
>opinions and is navel gazing.  I just got some ERNI rel reports on
pressfit
>into bare copper holes, but, in German, so I need to get translated.
>
>Dwight
>
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