At 03:36 PM 4/1/98 +0300, you wrote:
>   Is there  any test data to prove that galvanic couples do not pose
>any problem in
>  press fit application for telecom environment.

yes, but as far as i know it's all closely held/proprietary info.    The
gold pin/solder coated hole combination has at least 20 years of high rel
application demonstrated.  But no one has made their data public as far
I've been able to find in literature searchs et al

Actually the hotter topic of discussion and uncertainty is about using gold
pins in bare copper (OSP) or gold boards. Several large telecom
manufacturers and mainframe manufacturers have been pressing into gold and
OSP coated boards for at least 10-15 years (even in outdoor telecom app's)
but also haven't made their data public as far I've been able to find in
literature searchs et al.

 I'd love to see some data too. I'm planning to do the experiment/generate
the data on our own this year.  Crew at Litton/IPE and IBM Endicott are the
only contacts I've made who have done any of the basic science -- everyone
else I've come across who's willing to discuss it just has anecdotes and
opinions and is navel gazing.  I just got some ERNI rel reports on pressfit
into bare copper holes, but, in German, so I need to get translated.

Dwight

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