Hello all,

        Adding to the discussion of gold embrittlement, how would you address
the issue of maximizing gold thickness for wirebonding and minimizing gold
thickness for soldering operation on the same board surface?  In Table 3-2 of
IPC-6015, there is an acceptable range for Class 1 and 2 that can be worked
in, but with Class 3 there isn't.

        Maybe that's my answer...work in Class 1 or 2 only, specify gold
thickness, verify content, and establish influence on solder joint integrity
with respect to user environment.

        Has anyone else had to address this?

Glenn Pelkey
Maxtek Components Corp.

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