Hi Werner,

We use both, depending on the test specification, so I am curious, how do
the damage and/or failure mechanisms differ between thermal cycling and
temperature cycling?

Heidi Jones
Senior Manufacturing Engineer
Honeywell, Defense Avionics Systems
9201 San Mateo NE
Albuquerque, NM 87113-2227
(505) 828-5806
FAX (505) 828-5500
email: [log in to unmask]


----------
From:  Engelmaier[SMTP:[log in to unmask]]
Sent:  Friday, April 24, 1998 3:42 PM
To:  [log in to unmask]
Subject:  Re: [TN] high temperature solders

Hi Ed,
Thermal shock is NOT an accelerated test for loading due to thermal
cyling.
The damage mechanism is different then thermal cycling and therefore
passing a
thermal shock test does not assure 10 years of life in thermal cycling.
Thermal shock can be used for ESS and for HAST testing to increase general
robustness.

Werner Engelmaier
Engelmaier Associates, L.C.
Electronic Packaging, Interconnection and Reliability Consulting
7 Jasmine Run
Ormond Beach, FL  32174  USA
Phone: 904-437-8747, Fax: 904-437-8737
E-mail: [log in to unmask]

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