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April 1998

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Subject:
Re: NI/AU plating thickness
From:
Gary Ferrari <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 23 Apr 1998 22:06:28 -0500
Content-Type:
text/plain
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text/plain (48 lines) 
Dave,

You can find the recommended plating thicknesses inthe IPC-2221. It covers
thicknesses for gold on edge contact fingers, areas to be soldered, area to be
ultrasonic wire bonded, and areas to be thermosonic wire bonded. It also recommends
nickel thicknesses for areas on edge board connectors and areas to act as barrier
metals. In addition it covers electroless nickel and immersion gold thicknesses.

Regards,


Gary Ferrari
Executive Director
IPC Designers Council
(860) 350-9300 Fax (860) 350-9309
[log in to unmask]

>>> "Dave Pick -"process engineer"" <[log in to unmask]> 04/23/98 08:59PM >>>
After all the recent technet debate over nickel gold plating, I have a more
simple question. Is there a standard for nickel and gold plating thicknesses for
a SMT pad or PTH to be soldered; or at least a recommendation.

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